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DRC voltage text annotations: Manually placed texts can be wrong!

By Abdellah Bakhali System-on-chip (SoC) designs often use multiple intellectual property (IP) blocks from multiple IP providers. Each IP provider…

Do you trust the reliability of your 2.5D/3D IC package designs?

By Dina Medhat 2.5D/3D ICs have become an innovative solution for many design and integration challenges. Basic physical verification for…

Reliability checking for memory circuit design doesn’t have to destroy your eyesight!

By Hossam Sarhan Memory blocks contain sensitive analog circuits that are crucial for the proper functionality of the whole design….

DAC in December?? A Review of Calibre Design Solutions at DAC 2021

Did it feel a bit weird to be submitting research papers for DAC 2022 while packing to go to DAC…

Is there a quick and easy way to calculate P2P resistance or current density between any two coordinates in my IC design layout?

By Li Li Why, yes, there is! As you know, Calibre® PERC™ logic-driven layout (LDL) current density (CD) and point-to-point…

The “next” technology node: ready or not, here it comes

By Shelly Stalnaker For years, decades even, the semiconductor industry has lived by the process node, which was originally named…

Physical design engineers…Learn the secret to generating signoff fill in P&R and accelerating your tapeouts

By Srinivas Velivala Place and route (P&R) engineers are always on the lookout for ways to optimize their design flows…

IC package designers—looking for multi-die, system-level signoff verification?

By Shelly Stalnaker Ever tried a food sample when you were shopping…not just because it’s free food (!), but because…

Stronger together! Context-aware SPICE simulation combines the strengths of static and dynamic verification for faster, more precise full-chip ESD verification

By Neel Natekar Running dynamic simulations for full-chip ESD verification of ICs has become increasingly difficult (and in some cases,…