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MEMS Technology and Manufacturing on the Microscale

MEMS Technology and Manufacturing on the Microscale

By Carey Robertson and Khaled AbouZeid, Mentor Graphics Designers incorporating MEMS devices into high-volume CMOS ICs need new processes, data,…

Deja Vu for CMP Modeling?

Deja Vu for CMP Modeling?

By Jeff Wilson, Mentor Graphics With manufacturing innovations and new DFM solutions, CMP modeling is gaining renewed popularity

Assembly Design Kits are the Future of Package Design Verification

Assembly Design Kits are the Future of Package Design Verification

By John Ferguson, Mentor Graphics Like PDKs for ICs, qualified assembly design kits for packages can ensure the quality and…

Parasitic extraction for touchscreen designs

Parasitic extraction for touchscreen designs

By Mohamed ElRefaee, Mentor Graphics Accurate parasitic extraction of touchscreens is essential for ensuring the high-quality performance the market demands

Electrical Overstress Detection and Debugging

Electrical Overstress Detection and Debugging

By Dina Medhat, Mentor Graphics Automated voltage propagation provides an accurate way to detect and correct those hard-to-find EOS conditions…

Case Studies in P&R Double Patterning Debug: Part Two

Case Studies in P&R Double Patterning Debug: Part Two

David Abercrombie continues his expert advice to P&R and chip finishing engineers on understanding and debugging multi-patterning errors accurately and…

Case Studies in Double-Patterning Debug: Part One

Case Studies in Double-Patterning Debug: Part One

By David Abercrombie, Mentor Graphics Multi-patterning errors in P&R layouts can be intricate, and their solutions may not be obvious

The Changing (and Challenging) IC Reliability Landscape

The Changing (and Challenging) IC Reliability Landscape

By Matthew Hogan, Mentor Graphics Reliability issues have gone way beyond DRC and LVS verification…

The Fill Ecosystem Evolves Again

The Fill Ecosystem Evolves Again

By Jeff Wilson, Mentor Graphics At 20nm, new fill constraints drive up the time and complexity of the fill process….