How Do I ECO a Multi-Patterned Design?

How Do I ECO a Multi-Patterned Design?

By David Abercrombie and Alex Pearson, Mentor Graphics Applying ECOs to multiĀ­patterned designs can be a nightmare, unless you plan…

Colorless vs. Colored Double-Patterning Design Flows

Colorless vs. Colored Double-Patterning Design Flows

By David Abercrombie, Mentor Graphics How do you know which double patterning flow to use?

Collaborative SoC Verification

Collaborative SoC Verification

By Matthew Hogan, Mentor Graphics The increasing use of SoC designs turns efficient IC design and validation into a team…

Reducing Post-Placement Leakage with Stress-Enhanced Fill Cells

Reducing Post-Placement Leakage with Stress-Enhanced Fill Cells

By Valeriy Sukharev, Jun-Ho Choy, Armen Kteyan and Henrik Hovsepyan, Mentor Graphics Optimizing power usage for mobile devices at advanced…

Parasitic Extraction for Accurate Signal Integrity Analysis at Advanced Nodes

Parasitic Extraction for Accurate Signal Integrity Analysis at Advanced Nodes

By Karen Chow, Mentor Graphics Signal integrity analysis at advanced nodes requires new and enhanced parasitic extraction techniques

More Than Moore: Finally Crossing the Chasm?

More Than Moore: Finally Crossing the Chasm?

By Michael White, Mentor Graphics Will fan-out wafer-level packaging be the impetus that pushes 3D-IC into mainstream acceptance?  

An Automated Solution for Voltage-Aware DRC

An Automated Solution for Voltage-Aware DRC

By Dina Medhat, Mentor Graphics Automated voltage propagation with Calibre PERC makes it easier to comply with voltage-aware DRC spacing…

Resetting Expectations on Multi-Patterning Decomposition and Checking Part 2

Resetting Expectations on Multi-Patterning Decomposition and Checking Part 2

By David Abercrombie, Mentor Graphics Triple and quadruple patterning can baffle even the most experienced designers. David Abercrombie has some…

Electromigration and IC Reliability Risk

Electromigration and IC Reliability Risk

By Dina Medhat, Mentor Graphics Gradual damage from electromigration can affect product performance and reduce product lifetimes. Reliability analysis ensures…