E/E Systems Article Roundup
The following is a collection of recent industry articles on Capital E/E systems development and electrical systems.
1. Digital twins manage change in E/E design for aerospace
Publication: Tech Design Forum (September)
Description: Rapidly growth in electrical content has challenged modern avionics design teams. Not only has the amount of physical wire increased, adding weight and complexity, but the demand for the latest technology, along with increased regulation, has lead to the need for a comprehensive interconnected process to manage change. Enter the digital twin, a concept that allows design teams and their partners in the supply chain to manage that change in E/E design, helping to optimize manufacturing and enhance functionality.
2. Practical steps toward ECAD-MCAD integration for automotive design
Publication: Tech Design Forum (August)
Description: The increasing size of electrical networks can raise the cost of vehicle development two-fold due to the cost of the additional wiring and components and the time and resources required to design an ever more complex system. ECAD-MCAD integration can be critical for cross-functional design teams to maximize efficiency and produce high-quality products on shrinking timelines.
3. Automotive cybersecurity best practices – the latest on what you need to know
Publication: Siemens Blog (September)
Description: Continuous security threats on connected automobiles have exposed critical system vulnerabilities. To address these risks, regulatory agencies are now defining cybersecurity requirements by writing new legislation and holding carmakers and their supply chain liable for security and safety breaches. Read on to find out how you can address these cybersecurity threats.
Publication: Siemens Blog (September)
Description: A common problem among design teams that utilize the model-driven development approach is that many of the tests are not reusable across the various “Model-In-the-Loop” (MIL), “Software-In-the-Loop” (SIL) and “Hardware-In-the-Loop” (HIL) testbenches. (Incidentally, when all of these testing environments are used together, it is often referred to as “XIL.”) In order to be successful in terms of on-time, on-budget, and on-quality, it’s essential that teams be able to reuse verification and validation (V&V) testbenches across the entire XIL project. This post reveals a systematic and automated workflow that allows software teams to develop their electronic control unit V&V suites early during software modeling.
5. Siemens Hypervisor: Fulfilling the vision for today’s IVI systems
Publication: Siemens Blog (August)
Description: Utilizing virtualization in automotive software architecture provides an efficient way to implement vehicle communications and reduce the cost of adding additional MCUs to each platform. This can be achieved by encapsulating different heterogeneous automotive platforms inside virtual machines running on the same hardware. This blog explores the hypervisor emulation and how it also supports standards such as VirtIO for virtual devices or AUTOSAR for in-vehicle, real-time applications.
6. Siemens Capital takes on today’s challenges in aircraft electrical platforms (EBOOK)
Publication: Siemens Blog (August)
Description: For a comprehensive snapshot of how Siemens Capital E/E Systems development environment helps aerospace companies use a comprehensive digital twin to speed up program lifecycle development and introduce less risk into both design and manufacturing, check out this post.
7. Siemens Digital Industries Software confirms AUTOSAR Premium Partner status
Publication: Siemens Blog (July)
Description: AUTOSAR is the go-to standard to enable the digital thread for development of automotive embedded software and a key technology enabler for generative software development. This summer, Siemens Digital Industries Software became a Premium Partner through the AUTOSAR partnership. Read on to hear more about this exciting alliance.
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