What’s New in Xpedition® IC Packaging Design for VX 2.7

Mentor’s Xpedition® IC Packaging design tools bridge the gap between engineering teams for IC layout, package substrate design, and PCB layout with solutions for Chip/Package/PCB prototyping and co-design. They also deliver a complete solution for High Density Advanced Package (HDAP) rapid prototyping assembly, physical design, verification, signoff, and modeling.

Here are some highlights of the Xpedition® VX. 2.7 IC Packaging design tools release.

• Advanced Prototyping Optimization
• Differential Pairs Flow Support
• ODB++ teardrops import
• Route Obstruct Areas
• Manual Saw Tuning
• Sequential Multi-part Floorplanning
• Clearance Rules to NC Pins  …and more!

If you would like a preview of what’s new, please feel free to check out the What’s New in Xpedition IC Packaging VX.2.7 videos. Download this latest release from Support Center.