PCB (Printed Circuit Board) design layout optimization is critical for the success of SMT (Surface Mount Technology) assembly. SMT assembly involves placing surface mount components directly onto the surface of the PCB, as opposed to through-hole components, which require holes to be drilled through the PCB. SMT assembly is faster, more precise, and more cost-effective than through-hole assembly, but it requires careful design optimization to ensure a successful assembly process.

Z-planner V2023.1 builds on previous versions by enhancing rigid/flex useability, tighter integration with Xpedition and HyperLynx and the addition of more Mil-Aero materials to the dielectric materials library.

Creating the correct PCB stackup using the proper materials and then transferring that information to your fabricator is extremely important in the success of your PCB design.  Being able to “left-shift” this stage of your design process can add huge cost and quality savings into your entire design.

The PCB design process can be different depending on your company, but the fundamental aspects are all the same –...

Being able to quickly qualify materials based on your known electrical tolerances, and not upon the materials availability of your selected fabricator is key for efficient stackup design. This allows you to optimize the design around the available materials and take complete control of your stackup.