Xpedition® VX.2.11 is now available for download!

Before you read on, a newer version of Xpedition is now available. To learn more, visit the VX.2.12 product highlights…

Connect for PADS Professional

CONNECT – For PADS Professional

Going beyond your desktop workspace and seamlessly collaborating with teammates and partners worldwide in a secure cloud environment just got…

New 3D IC Podcast Launch

NEW PODCAST – We’re excited to announce the launch of our new podcast dedicated to 3D IC! Join me as…

Stoneridge: Addressing Digital Transformation with Xpedition Enterprise

Stoneridge’s global engineering team wanted to standardize their electronic systems engineering platform and evaluated enterprise ECAD systems to meet this…

NEPES partners with Siemens to streamline its advanced wafer-level IC Packaging wafer map mask creation process

NEPES partners with Siemens to streamline its advanced wafer-level IC Packaging wafer map mask creation process

Siemens’ Xpedition Package Designer automates a manual error prone process saving days of effort and reducing risk Seoul, South Korea.,…

Model and Simulate LED Dimmer Circuits in the SystemVision Cloud!

Have you ever wondered how to dim an LED? Well now is your chance to try it! No matter if…

What’s New in HyperLynx® – VX.2.8

Check out what’s new in the latest VX.2.8 release of HyperLynx – the industry’s complete family of analysis tools for…

Accelerate Design With Integrated FPGA-PCB I/O Co-Design

Accelerate Design With Integrated FPGA-PCB I/O Co-Design

Did you know that a PCB design tool flow with FPGA I/O Optimizer technology eliminates the barriers between FPGA and…

How RF Laboratories Drives Design Constraints in PADS Professional

How RF Laboratories Drives Design Constraints in PADS Professional

Designing electronic products with capabilities geared for the Internet of Things (IoT) is no longer the exception. It is the…