John McMillan
The role of AI-infused EDA solutions for semiconductor-enabled products and systems

The role of AI-infused EDA solutions for semiconductor-enabled products and systems

July 23, 2024
Discover why semiconductor-enabled products and systems are demanding AI-infused solutions and how AI is changing the nature of semiconductor design.
By John McMillan
< 1 MIN READ
Discover how AI is changing the nature of semiconductor design

Discover how AI is changing the nature of semiconductor design

July 16, 2024
AI is shaping the semiconductor industry’s future and its alignment with Siemens’ commitment to innovation and enhancing sustainability by accelerating...
By John McMillan
< 1 MIN READ
User2User 2024: Assembly verification flow for silicon interposers

User2User 2024: Assembly verification flow for silicon interposers

July 15, 2024
In this User2User 2024 session Broadcom's Suvarna Vikhankar presents “Assembly Verification Flow for Silicon Interposers with Embedded Deep Trench Capacitance”
By John McMillan
< 1 MIN READ
User2User 2024: Advanced physical verification flows for 3D IC's

User2User 2024: Advanced physical verification flows for 3D IC's

June 25, 2024
In this User2User 2024 video presentation, now available on-demand, Microsoft’s Amit Kumar discusses 3D IC verification flows with a focus...
By John McMillan
< 1 MIN READ
New innovative way to functionally verify heterogeneous 2D/3D package connectivity

New innovative way to functionally verify heterogeneous 2D/3D package connectivity

June 6, 2024
This blog introduces a white paper that addresses the challenges of verifying package connectivity and illustrated how to use formal tools to verify connectivity for package designs.
By John McMillan
< 1 MIN READ
Taking 2.5D/3D IC physical verification to the next level

Taking 2.5D/3D IC physical verification to the next level

February 21, 2024
Taking 2.5D/3D IC physical verification to the next level. As package designs continue to evolve, so must the verification requirements. Designers working on even the most complex multi-die, multi-chiplet stacked configurations require enhanced checking capabilities to quickly and easily verify that the physical die are placed correctly to ensure proper connectivity and electrical behavior.
By John McMillan
< 1 MIN READ
A deep dive into HDAP LVS/LVL verification

A deep dive into HDAP LVS/LVL verification

January 29, 2024
EDA companies are developing tools and workflows to support HDAP (High-density advanced packaging) LVS/LVL verification. Though the data for achieving “signoff-level” confidence is a work in progress, EDA companies are providing tools that can adapt to different levels of data availability and enable HDAP designers to execute HDAP LVS/LVL flows that are both productive and beneficial.
By John McMillan
< 1 MIN READ
Workflows for tackling heterogeneous integration of chiplets for 2.5D/3D semiconductor packaging

Workflows for tackling heterogeneous integration of chiplets for 2.5D/3D semiconductor packaging

January 11, 2024
Workflows for tackling heterogeneous integration of chiplets for 2.5D/3D semiconductor packaging.
By John McMillan
< 1 MIN READ
Parasitic extraction technologies: Advanced node and 3D-IC design

Parasitic extraction technologies: Advanced node and 3D-IC design

January 2, 2024
Advanced nodes and 3D-IC packages require new and enhanced parasitic extraction processes that can resolve a variety of complex parasitic issues in these designs.
By John McMillan
< 1 MIN READ
Impacts of 3D IC on the future

Impacts of 3D IC on the future

December 20, 2023
3D IC technology development started many years ago well before the slowing down of Moore’s law benefits became a topic...
By John McMillan
< 1 MIN READ
System-level, post-layout electrical analysis for high-density advanced packaging (HDAP)

System-level, post-layout electrical analysis for high-density advanced packaging (HDAP)

December 18, 2023
HDAP designs like FOWLP need post-layout simulation (analog) and post-layout STA (digital) flows to augment basic physical verification DRC and LVS.
By John McMillan
< 1 MIN READ
Crossing the chasm: Bringing SoC and package verification together

Crossing the chasm: Bringing SoC and package verification together

December 8, 2023
3D IC package designers need assembly-level LVS for HDAP verification.
By John McMillan
< 1 MIN READ
Package designers need assembly-level LVS for HDAP verification

Package designers need assembly-level LVS for HDAP verification

December 5, 2023
While advanced integrated circuit (IC) packaging is a fast-growing market, comprehensive package verification still has a ways to go. Unique...
By John McMillan
< 1 MIN READ
Understanding 3D IC Technology: Unveiling the Future of Integrated Circuits

Understanding 3D IC Technology: Unveiling the Future of Integrated Circuits

November 6, 2023
Delve into the world of 3D IC technology, its architecture, benefits, and applications. Learn how it's reshaping the future of integrated circuits for enhanced performance and efficiency.
By John McMillan
< 1 MIN READ
SemiWiki Podcast - An expert panel discussion on the move to chiplets

SemiWiki Podcast - An expert panel discussion on the move to chiplets

September 13, 2023
Listen in as Tony Mastroianni Advanced Packaging Solutions Director – Siemens EDA along with Saif Alam Vice President of Engineering...
By John McMillan
< 1 MIN READ
What’s New in Xpedition IC Packaging-VX.2.11

What’s New in Xpedition IC Packaging-VX.2.11

March 29, 2022
Xpedition IC Packaging VX.2.11 delivers capabilities targeting heterogenous integration and the prototyping, planning, design and verification of next-generation 2.5/3D package...
By John McMillan
< 1 MIN READ
PADS Professional VX.2.11 is Now Available!

PADS Professional VX.2.11 is Now Available!

March 28, 2022
PADS Professional solves the problems other unified PCB design tools don’t. With industry-leading placement, routing, and analysis technologies, PADS Professional contains everything you need...
By John McMillan
< 1 MIN READ
Plug-and-Play PID design - In the SystemVision Cloud!

Plug-and-Play PID design - In the SystemVision Cloud!

December 11, 2020
Did you ever wish you could just play with a PID control loop, to try “tuning” those P, I and...
By John McMillan
< 1 MIN READ
Mentor Communities Have a New Home!

Mentor Communities Have a New Home!

November 23, 2020
Mentor communities are now fully integrated with the Siemens Digital Industries Software communities. This integrated PCB Systems Design community experience...
By John McMillan
< 1 MIN READ
PADS Professional VX.2.8 is Now Available!

PADS Professional VX.2.8 is Now Available!

November 20, 2020
The new release of PADS Professional VX.2.8 is now available for download.
By John McMillan
< 1 MIN READ
Xpedition® VX.2.8 is now available for download!

Xpedition® VX.2.8 is now available for download!

November 10, 2020
Before you read on, a newer version of Xpedition is now available. To learn more, visit the VX.2.12 product highlights...
By John McMillan
< 1 MIN READ