Change is in the air, and it feels good

Change is in the air, and it feels good

If you have the feeling that everywhere you look you see articles about IoT, you’re probably right. It’s not often…

Collaborative management of design constraints

Collaborative management of design constraints

Most design teams would agree that as circuit complexity continues to increase, so has the criticality for efficient rules-driven design…

The World Has Changed, Yet Again

The World Has Changed, Yet Again

The internet was never designed to be part of society’s central infrastructure. It was developed for military purposes, in a…

Accuracy in HyperLynx

Accuracy in HyperLynx

I frequently get asked, “what is the maximum frequency that you can simulate in HyperLynx?”  And I usually say that…

The Internet of Things – Seize its Opportunities, Tackle Its Challenges

The Internet of Things – Seize its Opportunities, Tackle Its Challenges

Looking at our world today, you must have reflected on how much the connected world, the Internet of Things, has…

The Simulation Advantage

The Simulation Advantage

The advent of high-speed serial links added many challenges to the process of designing PCBs.  In some ways, it made…

Correlation up to 50GHz

Correlation up to 50GHz

Last week I attended DesignCon, and as usual correlation between simulation and measurement was a hot topic, especially for the…

Designing PCB’s for IoT – Part 1: IoT Everywhere

Designing PCB’s for IoT – Part 1: IoT Everywhere

A recent IHS report forecasted that the IoT market will grow from an installed base of 15.4 billion devices in…

Silicon Valley IC Packaging Seminar Validates Growing Proliferation of FOWLP

Silicon Valley IC Packaging Seminar Validates Growing Proliferation of FOWLP

If you’re interested in High Density Advanced Packaging (HDAP), our recent, focused seminar at Mentor Graphics’ Fremont campus was the…