{"id":3818,"date":"2015-03-04T12:40:52","date_gmt":"2015-03-04T19:40:52","guid":{"rendered":"https:\/\/blogs.mentor.com\/jimmartens\/?p=3818"},"modified":"2025-03-26T08:41:45","modified_gmt":"2025-03-26T12:41:45","slug":"sot-components-cad-library-series-part-2","status":"publish","type":"post","link":"https:\/\/blogs.stage.sw.siemens.com\/electronic-systems-design\/2015\/03\/04\/sot-components-cad-library-series-part-2\/","title":{"rendered":"SOT Components – CAD Library Series: Part 2"},"content":{"rendered":"

In part 2 of this 4 part\u00a0 CAD library white paper series we cover\u00a0 Small Outline Transistor (SOT)<\/strong><\/a>\u00a0 components.<\/p>\n

As mentioned in Part 1<\/a> of this series that focused on Molded Body components<\/a>, there are dozens of different things to consider when creating a CAD library including the precision of the part placement, via fanout, trace routing, post processing, fabrication and assembly processes.<\/p>\n

\"SOT<\/a><\/p>\n

 <\/p>\n

 <\/p>\n

This CAD library whitepaper is the second in this series and is dedicated to each aspect that should be considered when creating\u00a0Small Outline Transistor (SOT) library parts. It also describes the impact each feature has in the PCB process.<\/p>\n

The SOT component family includes several package types: the flat lead SOTFL, the SOT23’s in 3, 5, 6 and 8 gull wing lead packages, the SOT143 and 343 packages and the SOT 223. This paper discusses everything from the package types to the silkscreen, and from the placement courtyard to via fanout examples.<\/p>\n

\"WP<\/a>Click here<\/a><\/strong> to access the SOT Whitepaper <\/strong>now.<\/p>\n

You can download Part 1<\/strong> of this white paper series dedicated to the creation of Molded Body components<\/strong> by Clicking here<\/strong><\/a>.<\/p>\n

Click here<\/a> to learn more about the xDM Land Pattern Creator<\/strong><\/p>\n

And to learn more about Library Management<\/strong>, Click here<\/a>!<\/p>\n

Thanks for reading,\u00a0 and be on the lookout for Part #3: BGA Components<\/strong> soon!<\/p>\n

John<\/p>\n","protected":false},"excerpt":{"rendered":"

In part 2 of this 4 part\u00a0 CAD library white paper series we cover\u00a0 Small Outline Transistor (SOT)\u00a0 components. As…<\/p>\n","protected":false},"author":32176,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[13],"tags":[],"industry":[],"product":[],"coauthors":[],"class_list":["post-3818","post","type-post","status-publish","format-standard","hentry","category-news"],"_links":{"self":[{"href":"https:\/\/blogs.stage.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/3818","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.stage.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.stage.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.stage.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/users\/32176"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.stage.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/comments?post=3818"}],"version-history":[{"count":1,"href":"https:\/\/blogs.stage.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/3818\/revisions"}],"predecessor-version":[{"id":10301,"href":"https:\/\/blogs.stage.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/3818\/revisions\/10301"}],"wp:attachment":[{"href":"https:\/\/blogs.stage.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/media?parent=3818"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.stage.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/categories?post=3818"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.stage.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/tags?post=3818"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.stage.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/industry?post=3818"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.stage.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/product?post=3818"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.stage.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/coauthors?post=3818"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}