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Electronics & Semiconductors

At Siemens we see a symbiotic relationship between Semiconductors and Electronics that drives growth and innovation for both markets: Semiconductors, with their embedded intelligence delivered in rapidly shrinking form factors, representing a rising percent of the value of Electronics systems. Meanwhile, new and innovative categories of smart, connected products and devices are revolutionizing the electronics space, driving strong demand and affinity for innovative designs and products that deliver optimal convenience and entirely new consumer experiences. Design and manufacture of today’s complex products and semiconductor devices requires seamless collaboration across multiple domains including electrical, electronic, mechanical, simulation, software and data management.

Learn More


Tessent Solutions

The age of AI comes to IC test automation

January 18, 2024
Learn how artificial intelligence (AI) is advancing IC test and yield analysis.
By Ron Press
4 MIN READ

Electronic Systems Design

Are your alternative parts well validated before release

January 18, 2024
In alternate part selection, many aspects need to be considered: electrical function, physically fit, supply chain flexibility, cost, etc. Every aspect is important during alternative part selection, but realistically, electrical and physical fit are the main prerequisites when choosing a new alternative part. alternative parts well validated
By Bill Ji
4 MIN READ

Tessent Solutions

Video: Leveraging the RISC-V efficient trace (E-Trace) standard

January 16, 2024
Learn more about using the RISC-V efficient trace standard for non-intrusive, full-speed and system-level visibility.
By Tessent Solutions
2 MIN READ

Verification Horizons

Welcome to Verification Academy 2.0!

January 15, 2024
Step into the enhanced Verification Academy 2.0! After a year of meticulous development, we are thrilled to unveil its array...
By Harry Foster
2 MIN READ

Semiconductor Packaging

Workflows for tackling heterogeneous integration of chiplets for 2.5D/3D semiconductor packaging

January 11, 2024
Workflows for tackling heterogeneous integration of chiplets for 2.5D/3D semiconductor packaging.
By John McMillan
4 MIN READ

Opcenter

Introducing a Game-Changing Webinar: Revolutionizing User Experience for Electronics Manufacturers

January 08, 2024
Are you tired of inefficiencies on your shop floor? Do you want to streamline your production processes and achieve continuous...
By Alessandro Cereseto
2 MIN READ

Aprisa

Let AI help with macro placement during place and route

January 03, 2024
Aprisa’s AI-driven Auto Macro Placement (AMP) creates a high-quality floorplan in a fraction of the time needed for manual macro placement.
By Aprisa DI
5 MIN READ

Semiconductor Packaging

Parasitic extraction technologies: Advanced node and 3D-IC design

January 02, 2024
Advanced nodes and 3D-IC packages require new and enhanced parasitic extraction processes that can resolve a variety of complex parasitic issues in these designs.
By John McMillan
3 MIN READ

Semiconductor Packaging

Impacts of 3D IC on the future

December 20, 2023
3D IC technology development started many years ago well before the slowing down of Moore’s law benefits became a topic...
By John McMillan
3 MIN READ

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