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Electronics & Semiconductors

At Siemens we see a symbiotic relationship between Semiconductors and Electronics that drives growth and innovation for both markets: Semiconductors, with their embedded intelligence delivered in rapidly shrinking form factors, representing a rising percent of the value of Electronics systems. Meanwhile, new and innovative categories of smart, connected products and devices are revolutionizing the electronics space, driving strong demand and affinity for innovative designs and products that deliver optimal convenience and entirely new consumer experiences. Design and manufacture of today’s complex products and semiconductor devices requires seamless collaboration across multiple domains including electrical, electronic, mechanical, simulation, software and data management.

Learn More


Electronic Systems Design

Adapt to Design - Design for manufacturing

December 20, 2023
Design for manufacturing, or DFM, is a crucial aspect of electronics manufacturing best practices. It emphasizes that each printed circuit...
By Paul Carpine
2 MIN READ

Electronic Systems Design

What’s New in Valor NPI 2311

December 19, 2023
Each new Valor NPI release brings exciting features and improvements, and Valor NPI version 2311 is no different. One of the most prominent recent changes for release 2311 is the 3D board viewer. This allows users to toggle between the typical 2-D board view, and a 3-D board view. While less visually prominent, the addition of high-risk component detection is no less impactful among the overall improvements. The Valor Parts Library now associates individual components with a manufacturing risk value. This allows you to consider at-a-glance relative yield values based on component choices. Valor NPI version 2311 also facilitates the placement of XD components in a zigzag array.
By Maya Shani
4 MIN READ

Tessent Solutions

Three ways to slash AI chip TTM with advanced DFT and silicon bring-up

December 19, 2023
Advanced EDA technology eases AI chip development.
By Lee Harrison
6 MIN READ

Semiconductor Packaging

System-level, post-layout electrical analysis for high-density advanced packaging (HDAP)

December 18, 2023
HDAP designs like FOWLP need post-layout simulation (analog) and post-layout STA (digital) flows to augment basic physical verification DRC and LVS.
By John McMillan
3 MIN READ

Thought Leadership

Looking back on 2023 – A writer’s perspective pt. 2

December 14, 2023
Leveling up from the more specific discussion from part 1 about the near-term challenges facing automotive and transportation companies, we...
By Conor Peick
3 MIN READ

Siemens Xcelerator Academy

Continuous Learning: Empowering Success in the Digital Era

December 13, 2023
As Heraclitus wisely observed “The only thing that remains constant is change.” Change is an inevitable part of life, influencing...
By Cristiana Cerrato Accomazzo
3 MIN READ

Verification Horizons

IEEE Honors Siemens Employees for Dedication to Standards Development

December 12, 2023
Annually, the IEEE Standards Association (IEEE SA) recognizes outstanding participation across a variety of technical areas of standards development, leadership,...
By Tom Fitzpatrick
2 MIN READ


Simcenter

What’s new in Simcenter FLOEFD 2312? | CAD-embedded CFD simulation

December 11, 2023
Explore Simcenter FLOEFD 2312 CAD-embedded CFD software release that includes faster CFD meshing, PCB reflow oven simulation, Smart PCB modeling speed, structural mesh boolean operation (MB), a new API for simulation automation and much more
By Chris Watson, Peter Doughty
8 MIN READ

Semiconductor Packaging

Crossing the chasm: Bringing SoC and package verification together

December 08, 2023
3D IC package designers need assembly-level LVS for HDAP verification.
By John McMillan
2 MIN READ

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