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  1. Home
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Electronics & Semiconductors

At Siemens we see a symbiotic relationship between Semiconductors and Electronics that drives growth and innovation for both markets: Semiconductors, with their embedded intelligence delivered in rapidly shrinking form factors, representing a rising percent of the value of Electronics systems. Meanwhile, new and innovative categories of smart, connected products and devices are revolutionizing the electronics space, driving strong demand and affinity for innovative designs and products that deliver optimal convenience and entirely new consumer experiences. Design and manufacture of today’s complex products and semiconductor devices requires seamless collaboration across multiple domains including electrical, electronic, mechanical, simulation, software and data management.

Learn More


Opcenter

What’s new in Opcenter Intelligence Cloud 2310

December 07, 2023
Enhancing manufacturing insights to improve trend analysis and decision-making Using Opcenter Intelligence Cloud enables you to connect, organize and aggregate...
By Alessandro Cereseto
2 MIN READ

Semiconductor Packaging

Package designers need assembly-level LVS for HDAP verification

December 05, 2023
While advanced integrated circuit (IC) packaging is a fast-growing market, comprehensive package verification still has a ways to go. Unique...
By John McMillan
2 MIN READ

Siemens Software Podcast Network

The future of smart machines and smart industries – ep. 3

December 05, 2023
Today we conclude our special three-part podcast from Siemens Digital Industries Software investigating how software and automation technologies will combine...
By Conor Peick
< 1 MIN READ

Electronic Systems Design

Strengthening PCB Solder Connections

December 05, 2023
To increasing the overall solder strength within a PCB design, designers should be focusing on two distinct but related factors: The material composition of the solder, and the pad and footprint layouts for individual components. The composition of the solder itself will depend upon the application of the board, the components, construction method and materials within the board, and the overall final board quality. The overall footprint of the component will be dependent upon the components within a BOM and the recommended assembly guidelines of your assemblers. Both of these factors rely on discussions and interactions with your assembly house and leaving these discussions until after the design has been released ultimately limits your assembly options.
By Patrick Hope
6 MIN READ

Tessent Solutions

Awarding excellence: Siemens’ James Pickford wins BrightSparks award

November 30, 2023
Siemens’ James Pickford wins BrightSparks award.
By Tessent Solutions
2 MIN READ

Xcelerator for Startups Videos

Welcome to Siemens Startup Program

November 30, 2023
In January of 2020, Siemens launched Xcelerator for Startups, which is a program that offers our enterprise-level products to qualifying...
By Linh Nguyen
< 1 MIN READ

Siemens Software Podcast Network

The future of smart machines and smart industries – ep. 2

November 30, 2023
This is the second episode of a special three-part podcast from Siemens Digital Industries Software investigating how software and automation...
By Conor Peick
< 1 MIN READ

Aprisa

Watch Aprisa customer presentations from User2User 2023

November 29, 2023
Don’t miss these on-demand webinars to learn how you and your team of designers can too, benefit from Aprisa’s superior correlation, ease-of-use and adoption and minimal guidance to achieve optimal PPA in a short TAT.
By Aprisa DI
5 MIN READ

Custom IC Verification

‘SPICE up’ your Verification this holiday season!

November 28, 2023
Just as I wrapped up my fancy Thanksgiving cooking marathon, I couldn’t help but draw parallels between the meticulous artistry...
By Sumit Vishwakarma
2 MIN READ

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