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Electronics & Semiconductors

At Siemens we see a symbiotic relationship between Semiconductors and Electronics that drives growth and innovation for both markets: Semiconductors, with their embedded intelligence delivered in rapidly shrinking form factors, representing a rising percent of the value of Electronics systems. Meanwhile, new and innovative categories of smart, connected products and devices are revolutionizing the electronics space, driving strong demand and affinity for innovative designs and products that deliver optimal convenience and entirely new consumer experiences. Design and manufacture of today’s complex products and semiconductor devices requires seamless collaboration across multiple domains including electrical, electronic, mechanical, simulation, software and data management.

Learn More


Semiconductor Packaging

The impact of 3d heterogeneous integration on semiconductor device reliability

December 08, 2022
So far in our 3D IC blog series, we’ve discussed front-end design approaches to develop 3D IC-based devices, the importance...
By Heather George
21 MIN READ

Electronics & Semiconductors

Smarter Semiconductor Manufacturing Execution (Part 2 of 3)

December 07, 2022
In our first post, we talked about shifting left for smart manufacturing. This next post in the series brings us...
By Katie Tormala
3 MIN READ


Simcenter

Easy strength and fatigue analysis for any application case: efficiently assess the strength of your component  

December 06, 2022
Fatigue analysis templates and strength  Templates for fatigue analysis and their strength-only counterparts are relatively recent additions to Simcenter 3D....
By Michael Hack, Jonathan Melvin
6 MIN READ

Valor

What is the difference between data and analytics?

December 06, 2022
Manufacturing processes today generate enormous amounts of raw data. Collecting and storing big data is costly and doesn’t automatically deliver...
By Zac Elliott
2 MIN READ

Tessent Solutions

Webinar: How to implement DFT in 2.5/3D designs using Tessent Test software

December 05, 2022
Watch this on-demand webinar to learn about how the new Tessent Multi-die software automates the complex DFT tasks associated with 2.5D and 3D IC designs.
By Tessent Solutions
1 MIN READ

Electronics & Semiconductors

Shifting left for success in smart semiconductor manufacturing (Part 1 of 3)

November 29, 2022
Our first post in a three-part series on Smart Semiconductor Manufacturing begins with a shift left. Learn more about what...
By Katie Tormala
2 MIN READ

Valor

The missing link in PCB design analysis: electrical testability

November 28, 2022
On-demand webinar: Improving PCB testability within the design The design process for electronic products typically includes some form of functional...
By Mark Laing
2 MIN READ

Aprisa

How place-and-route with intrinsic intelligence solves advanced node challenges

November 17, 2022
Aprisa place-and-route with intrinsic intelligence is a unique tool for advanced node designs. Easy to adopt, out-of-the-box best PPA, and flexible, Aprisa is the right tool to fit into any digital flow.
By Janet Attar
3 MIN READ

Valor

The benefits and challenges of collecting big data

November 16, 2022
Companies operating in sensitive industries such as aerospace, automotive, smartphones, and medical need meaningful analytics to meet ever-increasing quality standards...
By Zac Elliott
3 MIN READ

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