ARM TechCon
As I outlined recently, I am attending a number of conferences in the next couple of weeks. The first one, next week, is ARM TechCon in Santa Clara, CA. This event spans 3 days – 29-31 October. The conference itself covers all 3 days; the exhibition is just days 2 and 3.
Each year this event seems to expand in size and scope and I have more things to do there …
Mentor Graphics has a significant presence at the event this year, with multiple divisions being involved. Mentor Embedded will have a demo available throughout the exhibition in booth #201.
I have two papers in the conference and another event:
Tuesday at 2:30 pm:
Interprocessor Communications and MCAPI
MCAPI is a standardized API for communication and synchronization between closely distributed cores and/or processors in embedded systems, defined and maintained by the Multicore Association.
This session outlines what MCAPI is, how it works and how it may be deployed in multicore systems. Included is a complete review of the API and example code to illustrate its usage.
Wednesday at 10:30 am:
USB 3 – An Introduction for Embedded Software Developers
USB is widely deployed in embedded devices of all kinds, resulting in simple interconnectivity and interoperability. This simplicity comes at a cost: the internal functions of USB are quite complex. This is of no consequence to the user of a USB-enabled device, but the embedded software developer does need some understanding of USB internals. Even if a commercial USB stack is employed, an appreciation of how it works enables it to be used optimally.
In this session, the history and internal operation of USB will be reprised in detail. Then, the changes and enhancements that come along with USB 3 will be reviewed.
Wednesday at 4 pm:
Meet and Greet – A chance to put faces to names …
Although I will be around during most of the show time, this is a specific time when I will be available at the booth. If you are around at ARM TechCon, do stop by and say hello.
If you would like copies of any of my presentation materials, please email.
