Siemens Digital Industries Software Blogs

To increasing the overall solder strength within a PCB design, designers should be focusing on two distinct but related factors: The material composition of the solder, and the pad and footprint layouts for individual components. The composition of the solder itself will depend upon the application of the board, the components, construction method and materials within the board, and the overall final board quality. The overall footprint of the component will be dependent upon the components within a BOM and the recommended assembly guidelines of your assemblers. Both of these factors rely on discussions and interactions with your assembly house and leaving these discussions until after the design has been released ultimately limits your assembly options.

Designing advanced package layouts with large areas of metal can be a daunting task, given the stringent requirements imposed by...

In the automotive sector, end-of-line testing uses vibroacoustic measurements to automatically and objectively detect faulty parts in the production line....

Utilizing 3D CAD models to model systems and systems-of-systems can significantly improve the efficiency and effectiveness of the product development...

Providing enhanced usability, formula development and regulatory roll ups for alternative BOMs We are excited to announce the availability of...

In the festive glow of twinkling lights and holiday cheer, the team found themselves facing a dilemma – Polarion licenses...

Note: To learn more about Solido Crosscheck’s QA exchange deck, check out the whitepaper https://resources.sw.siemens.com/en-US/white-paper-the-qa-exchange-deck-in-solido-crosscheck-enables-an-ip-qualification. This whitepaper discusses how the...

Reduce product cost and carbon footprint with smart transport selection based on pre-calculated cost and carbon impact

The University of Cincinnati uses NX to provide students with IDD with the tools to succeed in a STEM-based career...