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Tessent Solutions

Video: NXP Semiconductors success with Tessent for in-system test for ISO 26262

Learn how NXP Semiconductors implemented in-system test for automotive devices using Tessent, recorded at the 2023 European User2User conference.

By Tessent Solutions

Electronic Systems Design

PCB design best practices: analog mixed-signal (AMS)

What is analog mixed-signal analysis? Analog mixed-signal circuit simulation (AMS) is a technique for analyzing circuits in an integrated environment...

By Stephen V. Chavez

Accomplish more by customizing Material Models with the New User-Defined Subroutines in C++

Simulate the material complexity in your material models, with user-defined models in Simcenter Multimech.

By Luiz Lima, Jonathan Melvin

A Leader again in Worldwide Discrete Manufacturing in 2023 IDC MarketScape: Manufacturing Execution Systems vendor evaluation reports

IDC recently released a set of 2023 IDC MarketScape reports that assessed the capability and business strategy of many leading...

By Nash Chakraborty

Tessent Solutions

Video: Intel uses Tessent SSN for IC test and bring-up

Hear about Intel's use of Tessent SSN for test and silicon bring up, recorded at the 2023 European User2User conference.

By Tessent Solutions

What's new in NX | June 2023 | Core design

Welcome back to our latest what’s new instalment for NX™ software. Our latest release incorporates key feedback gathered from you,...

Out of the box validation checks | NX Tips and Tricks

Another installment of our Tips and Tricks series is here! This time we will be looking at how you can...

By Shannon McGinty

HiL and realistic environment simulations for your UAV

For a UAV to fly safely, its autonomous flight functions and localization capabilities must be flawless. Read this blog to learn through a use case how to implement a HiL simulation framework into your development process.

By David Pla Guerrero

Semiconductor Packaging

A workflow methodology for homogeneous disaggregation using hierarchical device planning

Advancements in IC packaging manufacturing, combined with the exploding costs of designing monolithic ICs on today’s advanced process nodes, have...