The Xpedition high density advanced packaging solution it is made up of two core products, Xpedition Substrate Integrator (xSI) which…
If you’re designing a high-performance processor-based package, it’s common for the semiconductor package design to contain multiple logic chips that…
People have been designing “modules” or system-in-packages (SiP) for a number of years; but in the last 3-5 years, I…
“Golden signoff” – The final step in the semiconductor packaging process In my last blog post, I talked about the…
Scalability and range of IC packaging design solutions In my last blog, I talked about multi-domain and cross-domain integration that…
Multi-domain integration enables faster time to market for complex advanced semiconductor packages with a seamless integration of design and verification.
Part 1: An advanced IC packaging design and verification solution For many applications, next generation IC packaging is the best…
Over last 2-3 years, everyone has been talking about Moore’s “Law” becoming invalid. Even if it does, we will continue…
