Parasitic extraction technologies: Advanced node and 3D-IC design

Advanced nodes and 3D-IC packages require new and enhanced parasitic extraction processes that can resolve a variety of complex parasitic issues in these designs.

System-level, post-layout electrical analysis for high-density advanced packaging (HDAP)

HDAP designs like FOWLP need post-layout simulation (analog) and post-layout STA (digital) flows to augment basic physical verification DRC and LVS.

Crossing the chasm: Bringing SoC and package verification together

3D IC package designers need assembly-level LVS for HDAP verification.

Package designers need assembly-level LVS for HDAP verification

While advanced integrated circuit (IC) packaging is a fast-growing market, comprehensive package verification still has a ways to go. Unique…

An image of an IC package design in Xpedition Package Designer with text that says: Achieving substrate supplier fabrication requirements: a designer's guide

Achieving substrate supplier fabrication requirements: a designer’s guide

Designing advanced package layouts with large areas of metal can be a daunting task, given the stringent requirements imposed by…

Image of chiplets with text onscreen saying HBM

High Bandwidth Memory (HBM): Unleashing the power of next-gen memory technology

In the ever-evolving realm of semiconductor technology, one innovation stands out above the rest: High Bandwidth Memory (HBM). Offering unparalleled…

system technology co-optimization

Shifting left with system technology co-optimization for IC packaging

We have witnessed and learned about the industry’s significant shift in semiconductors. The traditional approach of transistor scaling, once universally…

Image of an IC package design with text that says A workflow methodology for homogeneous disaggregation using hierarchical device planning

A workflow methodology for homogeneous disaggregation using hierarchical device planning

Advancements in IC packaging manufacturing, combined with the exploding costs of designing monolithic ICs on today’s advanced process nodes, have…

Illustration of an IC Package design with text that says Why are you spending 30%+ more time on semiconductor packaging design?

Why are you spending 30%+ more time on semiconductor packaging design?

Designs are just getting bigger and more complex Yes, an obvious aspect is increasing design complexity. Packages are now a…