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Assembly Verification Flow for Silicon Interposers with Embedded Deep Trench Capacitance

User2User 2024: Assembly verification flow for silicon interposers

July 15, 2024

In this User2User 2024 session Broadcom’s Suvarna Vikhankar presents “Assembly Verification Flow for Silicon Interposers with Embedded Deep Trench Capacitance”

By John McMillan
2 MIN READ
Advanced Physical Verification Flows for 3DICs

User2User 2024: Advanced physical verification flows for 3D IC’s

June 25, 2024

In this User2User 2024 video presentation, now available on-demand, Microsoft’s Amit Kumar discusses 3D IC verification flows with a focus…

By John McMillan
3 MIN READ