The demand for increased power and performance in semiconductor packages has surged. As more die and chiplets are integrated into…
3D IC technology development started many years ago well before the slowing down of Moore’s law benefits became a topic…
Designing advanced package layouts with large areas of metal can be a daunting task, given the stringent requirements imposed by…
In the ever-evolving realm of semiconductor technology, one innovation stands out above the rest: High Bandwidth Memory (HBM). Offering unparalleled…
The new VX.2.14 release of Xpedition IC Packaging includes improvements and enhancements to both Xpedition Substrate Integrator and Xpedition Package…
We have witnessed and learned about the industry’s significant shift in semiconductors. The traditional approach of transistor scaling, once universally…
Advancements in IC packaging manufacturing, combined with the exploding costs of designing monolithic ICs on today’s advanced process nodes, have…
The key analysis needs of high-performance computing semiconductor package design Today, power requirements are continually increasing as you bring more…
Designs are just getting bigger and more complex Yes, an obvious aspect is increasing design complexity. Packages are now a…
