Advancements in IC packaging manufacturing, combined with the exploding costs of designing monolithic ICs on today’s advanced process nodes, have…
Designs are just getting bigger and more complex Yes, an obvious aspect is increasing design complexity. Packages are now a…
The connectivity management complexity of package assemblies where multiple chiplets/ASICs and memory are heterogeneously integrated, introduces a great deal of…
In our last 3D IC blog, we talked about the impact of 3D IC on device reliability. In today’s blog,…
If you’re designing a high-performance processor-based package, it’s common for the semiconductor package design to contain multiple logic chips that…
Each Industrial Revolution resulted in advancements that propelled humans forward into a seemingly different world. The first in 1784 was…
“Golden signoff” – The final step in the semiconductor packaging process In my last blog post, I talked about the…
So far in our 3D IC blog series, we’ve discussed front-end design approaches to develop 3D IC-based devices, the importance…
Scalability and range of IC packaging design solutions In my last blog, I talked about multi-domain and cross-domain integration that…
