Will your electronics survive an earthquake?
It’s a valid question. What if you could effectively verify the integrity of electronic assemblies and component – before you manufactured the product?
Electronic assemblies are subject to dynamic loads such as jolts, earthquakes, and other jarring motions. The need to effectively verify the integrity of electronic assemblies and components can be solved by stress and dynamic simulation long before production. Often, higher-level validation is required via digital simulation using stress and dynamics analysis.
Register now and join us on Tuesday, June 9, at 10 AM EDT for a short, 30-minute webinar entitled “Digital Simulation of Assemblies of Assemblies and Components”.
In this webinar you will learn how to:
- Extract structural and dynamic loads
- Setup stress and dynamics analyses
- Postprocess results
Learn how you can predict performance across all critical attributes earlier and throughout the entire product lifecycle. Optimize your designs and deliver innovations faster and with greater confidence.
Learn how to earthquake-proof your electronics with digital simulation. Sign up today!
