IC package thermal modeling

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Leveraging a Material Map for IC package and PCB thermal analysis | Simcenter Flotherm

April 10, 2024

Explore how the Material Map SmartPart in Simcenter Flotherm software enables accurate fast, PCB thermal analysis and IC package substrate and die modeling

By Byron Blackmore
5 MIN READ
Embeddable BCI-ROM Reduced order thermal models for 3D CFD electronics cooling simulation | Package thermal modeling Simcenter Flotherm

Embeddable BCI-ROM Technology: reduced order thermal models for 3D CFD electronics cooling simulation

October 30, 2023

Learn how reduced order thermal models for 3D CFD electronics cooling simulation help the electronics thermal management supply chain – new Embeddable BCI-ROM technology in Simcenter Flotherm software is now available

By Byron Blackmore
9 MIN READ
Simcenter Flotherm 2310 | Electronics cooling simulation including BCI-ROM reduced order models for 3D CFD thermal analysis

What’s new in Simcenter Flotherm 2310 and Simcenter Flotherm XT 2310

October 26, 2023

Learn about accurate reduced order thermal models for 3D CFD electronics cooling simulation that protect IP in Simcenter Flotherm 2310 and about the latest for Simcenter Flotherm XT 2310 software

By Byron Blackmore
5 MIN READ