Two different package styles, two very different thermal responses when a extruded plate fin heatsink is placed on each. At…
A common enough question. Heatsinks are often perceived to be the magic answer to all electronics cooling challenges. They should…
In the royal family of thermal IC package modelling types, a detailed model is King. All critical 3D geometry is…
By way of an apology for the more verbose blogs I’ve been issuing recently I’d like to present you with…
Electronics cooling simulation was born out of the world of CFD, rather fully conjugate heat transfer simulation where convective, radiative…
The JESD51-14 standard was published in November 2010, prepared by the JEDEC JC-15 Committee on Thermal Characterization. It outlines a…
The temperature rise that electronic components attain in operation is due to 3 things. The power that they dissipate, the…
Before you sell it, or commission it, you want to be sure that it works. Monies have been spent on…
I put the title in quotes as it’s the title of a blog post by John Chawner at Pointwise who…
