In the rapidly evolving landscape of System on Chip (SoC) development, the demand for effective debugging and optimization is becoming…
Learn more about using the RISC-V efficient trace standard for non-intrusive, full-speed and system-level visibility.
Siemens’ James Pickford wins BrightSparks award.
Learn how to use Tessent test solutions for functional safety and automotive applications. This video was recorded at the 2023 Design Automation Conference.
Learn how Tessent Embedded Analytics accelerates SoC debus and ongoing silicon monitoring though the IC lifecycle. This video was recorded at the 2023 Design Automation Conference.
Learn how Tessent Multi-die software helps implement design-for-test structures for 2.5D and 3D designs. This video was recorded at the 2023 Design Automation Conference.
Learn how STMicroelectronics used Tessent defect-oriented test to improve the quality of devices for their automotive customers. This video was recorded at the 2023 European User2User conference.
Learn how Qualcomm reduced test pattern count using Tessent testpoint technology. This video was recorded at the 2023 European User2User conference.
Learn how Testonica used Tessent to implement an FPGA-based reference system for pre-silicon evaluation and validation of a target IJTAG infrastructure. This video was recorded at the 2023 European User2User conference.
