VTS 2020 best paper_Tessent

Tessent wins Best Paper award at IEEE VLSI Test Symposium

The best paper of the 2020 symposium describes a layout-friendly EDT decompressor that reduces routing congestion associated with decompressor circuitry…

Secure and Up-to-date: Monitor and Control Automotive devices with Over-the-Air Updates

By Lee Harrison – Automotive Test Solutions Manager, Siemens EDA The topic of safety and security for automotive ICs and…

Tessent Silicon Lifecycle Solutions

What is silicon lifecycle management?

The next step in IC test and monitoring by Aileen Ryan – Senior Director of Portfolio Strategy, Siemens Digital Industries…

Tessent LBIST with Observation Scan Technology Wins Elektra Design Tool Award 2020

A Tessent technology was awarded the 2020 Elektra Design Tools and Development Software Award from a crowded field of nominated…

Improve defect detection for competitive, high-quality SoCs

To deliver the highest quality SoCs, these manufacturing test strategies ensure defects are detected before it’s too late. It is…

Introducing Tessent Streaming Scan Network

Slash test costs and reduce implementation effort for complex next-generation SoCs. IC engineering teams have seen a dramatic rise in…

DFT and the competitive edge

Advanced DFT is your competitive edge Every new SoC project starts with grand hopes of glory. This one will be…

Tessent Wraps Up Summer Webinar Series

The summer of 2020 featured several new webinars from the Tessent Test Solutions group at Mentor, a Siemens business. These…

Using critical area to optimize test patterns

Using critical area to optimize test patterns

In a new technical paper, Ron Press, the director of technology enablement for the Tessent Test Solutions, describes the new…