Latest posts

Video: Seagate presents RISC-V debug and optimization with Tessent

Learn how Seagate used Tessent Embedded Analytics for RISC-V debug and optimization in this presentation and Q&A recorded at the 2023 U2U North America.

Image showing the architecture of a bus-based packetized scan test delivery system. Each core’s DFT can be designed independently and with the most optimal compression configuration.

Video: Generating clocks in Tessent Streaming Scan Network

Learn about generating clocks in Tessent Streaming Scan Network (SSN) in this presentation and Q&A recorded at the 2023 U2U North America.

A new way to solve systematic failures and boost yield

A novel approach from Siemens and PDF Solutions shows promise in speeding yield ramp on advanced nodes and solving yield…

Designed-in automotive cybersecurity to beat the hackers

Connected vehicles are vulnerable to cyberattack. Designing-in security features future-proofs vehicles against hackers.

The future of in-system testing for automotive safety

Suppliers of IP for automotive applications must ensure their IP blocks are ISO 26262 compliant. Siemens has the solutions for automotive safety and reliability.

Don’t Miss Silicon Lifecycle Solutions at U2U

Don’t miss the exciting lineup of Tessent Test and Embedded Analytics presentations at U2U North America on A[ril 13, 2023.

On-demand Webinar: Faster DFT, better results

Learn about faster DFT and better results using the bus-based packetized test of Tessent Streaming Scan Network.

Event: Tessent 2023 DFT Tech Forum

Attend the 2023 DFT Tech Forum to learn how Tessent silicon lifecycle solutions solve your complex SoC DFT challenges.

Webinar: How to implement DFT in 2.5/3D designs using Tessent Test software

Watch this on-demand webinar to learn about how the new Tessent Multi-die software automates the complex DFT tasks associated with 2.5D and 3D IC designs.