Tessent Solutions

The Tessent silicon lifecycle solutions provide IP and applications that detect, mitigate and eliminate risks throughout the IC lifecycle, from the design-for-test phase through continuous IC monitoring. Tessent helps customers address their debug, manufacturing test, yield, functional safety, IC security, and optimization requirements for today’s most complex SoCs.

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D&R IP-SoC Day 2022 Silicon Valley

Siemens EDA talks cybersecurity at IP-SoC Silicon Valley

April 1, 2022

The Tessent group participated in the “unique event fully dedicated to IP and IP-based electronic systems,” D&R IP-SoC Silicon Valley…

By Tessent Solutions
< 1 MIN READ
Automated shared bus interface memory test

Webinar: Memory test using a shared bus Interface

March 31, 2022

The explosive growth in the use of memory content on SoCs calls for a new solution to effectively access the…

By Tessent Solutions
< 1 MIN READ

Join Siemens EDA at GOMACTech 2022

March 9, 2022

Where design and innovation meets tomorrow Siemens EDA is looking forward to exhibiting a broad array of technologies spanning from…

By Tessent Solutions
2 MIN READ

Webinar: Smarter DFT architecture for advanced SoCs

February 18, 2022

Leonardo DaVinci said that “Simplicity is the ultimate sophistication.” Semiconductor design is a very complex process, and every step of…

By Tessent Solutions
2 MIN READ

Webinar: Break through yield barriers with Siemens and PDF Solutions

February 17, 2022

Webinar now available on-demand With the high cost of developing ICs at advance nodes, the pressure to maximize yield and…

By Tessent Solutions
< 1 MIN READ

For secure chips, use high-quality test and embedded analytics

February 2, 2022

There is growing concern over the security of ICs used not just in aerospace and military devices, but also in…

By Tessent Solutions
3 MIN READ

Tessent earns TSMC OIP Partner of the Year for 3DFabric collaboration

December 1, 2021

Recognition of Tessent’s excellence in next-generation system-on-chip and 3DIC design enablement. Siemens EDA takes industry partnerships seriously, and sometimes we…

By Tessent Solutions
< 1 MIN READ

ISTFA 2021

October 28, 2021

Don’t miss the 47th International Symposium for Testing and Failure Analysis (ISTFA 2021) in Phoenix, Arizona from October 31 to…

By Tessent Solutions
2 MIN READ
ITC 2021 logo

International Test Conference 2021

October 6, 2021

Join Siemens at the International Test Conference 2021 (ITC) to be held virtually from October 10-15, 2021. We’ll be showcasing technologies…

By Tessent Solutions
2 MIN READ