Latest posts

Manage the effects of chip complexity with Embedded Analytics

By Richard Oxland – Siemens Digital Industries Software If you’ve never heard of Embedded Analytics, it’s time to learn how…

VTS 2020 best paper_Tessent

Tessent wins Best Paper award at IEEE VLSI Test Symposium

The best paper of the 2020 symposium describes a layout-friendly EDT decompressor that reduces routing congestion associated with decompressor circuitry…

Secure and Up-to-date: Monitor and Control Automotive devices with Over-the-Air Updates

By Lee Harrison – Automotive Test Solutions Manager, Siemens EDA The topic of safety and security for automotive ICs and…

Tessent Silicon Lifecycle Solutions

What is silicon lifecycle management?

The next step in IC test and monitoring by Aileen Ryan – Senior Director of Portfolio Strategy, Siemens Digital Industries…

Tessent LBIST with Observation Scan Technology Wins Elektra Design Tool Award 2020

A Tessent technology was awarded the 2020 Elektra Design Tools and Development Software Award from a crowded field of nominated…

Improve defect detection for competitive, high-quality SoCs

To deliver the highest quality SoCs, these manufacturing test strategies ensure defects are detected before it’s too late. It is…

Introducing Tessent Streaming Scan Network

Slash test costs and reduce implementation effort for complex next-generation SoCs. IC engineering teams have seen a dramatic rise in…

Tessent’s ITC 2020 wrap-up

The International Test Conference carried on this year as a virtual event. It’s a difficult format to make work, but…

DFT and the competitive edge

Advanced DFT is your competitive edge Every new SoC project starts with grand hopes of glory. This one will be…