Learn how Broadcom used Tessent Multi-die to build a 3D IC flow in this video recorded at the 2023 North America U2U symposium.
Don’t miss the exciting lineup of Tessent Test and Embedded Analytics presentations at U2U North America on A[ril 13, 2023.
Yes, there is a path to a scalable, affordable, and comprehensive DFT solution for 3D ICs.
